Qualcomm S7 and S7 Pro Gen 1 Sound Platforms announced

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Qualcomm has introduced the Qualcomm S7 and S7 Pro Gen 1 Sound platforms at the Snapdragon Summit today. These cutting-edge audio platforms are engineered for earbuds, headphones, and speakers, with the aim of revolutionizing the audio landscape by combining high performance, low energy consumption, on-device AI, and advanced connectivity.

The S7 and S7 Pro Gen 1 Sound platforms represent a substantial leap in on-device AI capabilities. They provide six times the computing power and nearly 100 times the AI capacity compared to their predecessors. These platforms deliver premium audio performance at low power consumption levels.

Qualcomm Expanded Personal Area Network (XPAN)

The S7 Pro Sound platform is the first to support Qualcomm’s XPAN technology and micro-power Wi-Fi connectivity. This extends the range of audio devices, enabling users to roam freely within a home, building, or campus while enjoying music or making calls.

Enhanced User Experiences

These platforms employ powerful on-device AI, working in tandem with Active Noise Cancellation and Personal Sound Amplification technologies. This ensures that earbuds and headsets respond more effectively to user preferences and adapt to changing environments throughout the day.

Advanced ANC and Low-Latency DSP

The S7 and S7 Pro Gen 1 Sound platforms boast Qualcomm’s 4th Gen Adaptive Active Noise Cancellation (ANC) and fully programmable, low-latency DSP. These features deliver superior ANC performance, enabling seamless transitions between modes based on the listening environment.

Key Highlights of S7 & S7 Pro Gen 1 Sound Platforms
  • Enhanced Performance: These platforms feature a new architecture with increased compute power, memory, and dedicated AI components.
  • Qualcomm XPAN Technology: A groundbreaking connectivity solution that keeps earbuds connected, even when your phone is in another room.
  • Hearing Enhancement: On-device AI enhances hearing enhancement technologies for a more seamless user experience.
  • 4th Gen ANC: Hardware improvements result in low-latency, multi-channel, and low-power ANC, offering impressive performance.

Features of S7 & S7 Pro Gen 1 Sound Platforms
  • Advanced Architecture: Unlocks a new level of performance while maintaining low power consumption.
  • Dedicated AI Core: Provides high-performance, low-power machine learning capabilities.
  • Audio Curation Cores: Support hearing loss compensation, ANC, transparency, and noise management.
  • High-Quality Audio: Features a Hi-Fi-grade stereo audio codec.
  • Bluetooth 5.4: Offers Bluetooth and Bluetooth LE Audio experiences.
  • Enhanced Audio Development: Includes USB High-Speed PHY for improved audio development workflows.
  • Seamless Connectivity: Allows seamless transitions between Wi-Fi and Bluetooth.
  • Whole Home Coverage: Supports Qualcomm XPAN for extended audio range.
  • High Data Rates: Up to 29 Mbps, enabling lossless music streaming over Wi-Fi.

Commenting on the launch, Dino Bekis, Vice President and General Manager, Wearables and Mixed Signals Solutions, Qualcomm Technologies, said:

These platforms set a new benchmark for high-performance sound at ultra-low power. They are packed with premium technologies that work together with on-device AI to deliver immersive and personalized audio experiences wherever you go – whether in a meeting, socializing, gaming, listening to music, or simply needing some quiet time.

The S7 Pro Platform, featuring micro-power Wi-Fi and the revolutionary Qualcomm XPAN technology, takes the sound experience to the next level by enabling whole-home and building audio coverage, supporting up to 192kHz multi-channel lossless music streaming, and enhancing multi-channel spatial audio for gaming.

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